Use Fisher’s LSD method with α = 0.05 test to analyze the means of the three flow rates in In “Orthogonal Design for Process Optimization and Its Application to Plasma Etching”, G. Z. Yin and D. W. Jillie describe an experiment to determine the effect of C2F6flow rate on the uniformity of the etch on a silicon wafer used in integrated circuit manufacturing. Three flow rates are used in the experiment, and the resulting uniformity (in percent) for six replicates is shown below.
Observations
C2F6Flow (SCCM)
1
2
3
4
5
6
125
2.7
4.6
2.6
3.0
3.2
3.8
160
4.9
5.0
4.2
3.6
200
3.4
2.9
3.5
4.1
5.1
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