Suppose the "bad" layout seen in Fig. Ex4.1 is used to fabricate an NMOS device. Will the poly be doped? Why or why not?
Comment on the problems with the MOSFET layout seen in Fig. Ex4.1. In Fig. Ex4.1a the active layer defines an opening in the field oxide. The select masks are placed exactly where the desired n+ implants will occur, as seen in Fig. 4.3. However, due to shifts in the select mask, relative to the poly mask, the area directly next to the gate will not get implanted. (Redraw Fig. Ex. 4.1b with the poly layer shifted left or right.) Notice how the incorrect layout in Fig. Ex4.1b looks exactly the same as the correct layout in Fig. 4.3a. ■
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