Mechanical stress effects and failures similar to those described in Chapter 10, but on a much smaller scale, occur in IC silicon dies, metal contacts and wires, solder, and plastic packages. Provide...

Mechanical stress effects and failures similar to those described in Chapter 10, but on a much smaller scale, occur in IC silicon dies, metal contacts and wires, solder, and plastic packages. Provide actual (or potential) examples of such degradation and failure.